| 摘要 |
PROBLEM TO BE SOLVED: To deposit adequate quantity of molten solder according to the lead shape of different kinds of electronic components on a single printed circuit board to improve the solder quality and reliability. SOLUTION: A motor 14 and computer 16 automatically adjust the angle of a guide plate 11 during transporting of a printed circuit board 84 so that the head of molten solder 95 at a peel back point(PBP) varies to adjust the shape of a jet flow wave, the peel back point position varies to the printed circuit board 84 and hence adequate quantity of molten solder corresponding to each lead of electronic component mounted on the single printed circuit board 84 deposits even if the shape, length and density of the leads differ, i.e., about the leads on the same printed circuit board 84, the jet flow wave of molten solder is varied so as to fit to either part where no bridge is to occur or part where much solder wants.
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