发明名称 ELECTRONIC COMPONENT MOUNTING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting board, where a solder terminal which is attached to a wiring conductor formed on the insulating board is hardly damaged due to fatigue even if heat is cyclically applied between an insulating board and an outer electric circuit board, the electrodes of an electronic component mounted on the insulating board can be normally connected to an outer electric circuit for a long term, and the wiring board hardly causes lead contamination to the environment. SOLUTION: Wiring conductors 4 connected to the electrodes of an electronic component 3 are formed on the surface of an insulating board 1, and solder terminals 2 connected to outer electric circuits are attached to some of the wiring conductors 4 for the formation of an electronic component mounting board, where the solder terminals 2 are formed of alloy of 96 to 98 wt.% tin and 2 to 4 wt.% silver. A fatigue failure hardly occurs in the solder terminals 2, and the solder terminals 2 contains no lead, so that the electronic part mounting board causes no lead contamination to the environment.
申请公布号 JP2000022026(A) 申请公布日期 2000.01.21
申请号 JP19980180850 申请日期 1998.06.26
申请人 KYOCERA CORP 发明人 MATSUDA SHIN;SATO SHINGO;UEGAKI SHIYOUJI
分类号 B23K35/26;H01L23/12;H05K3/34;(IPC1-7):H01L23/12 主分类号 B23K35/26
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