| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for exchanging a semiconductor device, wherein a satisfactory wiring pad surface is provided at re-connection without breaking a circuit substrate or peripheral part, at removal of the semiconductor device. SOLUTION: A part of a mounting structure which is between the upper surface of a semiconductor device on a circuit board 7 and at least to its lower surface height is removed, using a drill 6 for flattening its surface. Then, a metal plate 5 where a solder 9 is formed on its surface is made to hit a bump electrode 1 under heated condition. Then the metal plate 5 is detached after the temperature is lowered. Thus, the bump electrode 1 present in a sealing resin 8 is removed, while the sealing resin 8 left. |
