| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of the manufacturing process as a whole of a semiconductor device, and to shorten the manufacturing time. SOLUTION: A linear semiconductor material 30, on whose surface a metal thin film and a resist film are formed, is carried at a constant speed by rotating rollers 142 and 144. An aligner 140 on which proximity light generators 154 are radially arranged is provided between the rollers 142 and 144. The straight- shape semiconductor material 30 is put through a cylindrical hole 152 of the aligner 140, the surface of the straight-shape semiconductor 30 is exposed with proximity lights, and fine circuit patterns are plotted on the surface of the straight-shape semiconductor 30. The semiconductor element 30, on which the circuit patterns are plotted, is developed and etched so that an electrode can be formed and cut in constant lengths. Thus, a semiconductor device can be manufactured by using the semiconductor material 30 of a constant length. |
