| 摘要 |
PROBLEM TO BE SOLVED: To improve a joint quality, wherein an IC chip is joined to an individual substrate, while eliminating the need for a process for dividing a substrate, using a pre-divided individual substrate, so that no stress acts on the joint part between a bump and a joint electrode, in a method and a device for manufacturing an electronic component. SOLUTION: A pallet 60 holding a plurality of individual substrates 60 is positioned on a bonding stage part 11, each substrate 60 is pushed upward by a protrusion 36 which protrudes above the upper surface of the bonding stage part 11 while being held by a pallet 61. While each substrate 60 is being clamped under pressure for fixing with a pressuring means 45 provided on the bonding stage part 11 capable of rising/falling, an IC chip 5 is sequentially supplied on each individual substrate 60 for ultrasonic wave joint, making certain that no individual substrate 60 moves at the ultrasonic wave joint for assured joint quality.
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