发明名称 SOLDER INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a solder inspection device capable of confirming and analyzing the printed state of each solder-printed part accurately, concerning the solder inspection device for inspecting the quality of the printed state of a cream-like solder printed on a print board. SOLUTION: This inspection device is equipped with an image pickup means 14 for picking up the image of a solder-printed part on a board to be inspected P2, an image processing means 24 for producing data to be inspected from the image of the solder-printed part picked up by the image pickup means 14, an inspection means 26 for inspecting the printed state of the solder-printed part by comparing the data to be inspected with a decision data memorized beforehand, an inspection result memory means 28 for memorizing inspection result data showing an inspection result by the inspection means 26, an image memory means 29 for memorizing image data showing the image of the solder- printed part picked up by the image pickup means 14, and an output means 32 for correlating the inspection result data with the image data and for outputting it.
申请公布号 JP2000019123(A) 申请公布日期 2000.01.21
申请号 JP19980188339 申请日期 1998.07.03
申请人 OMRON CORP 发明人 ISHIBANE MASATO
分类号 G01N21/88;G01N21/93;G01N21/956;(IPC1-7):G01N21/88 主分类号 G01N21/88
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