发明名称 VACUUM TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To easily and surely detect the abnormal leak of an H gas, when a semiconductor wafer is laid on a holder in a vacuum chamber and a thermally conductive gas, e.g. He gas is fed to a gap between the wafer and holder to make a film forming process or etching, while maintaining the wafer at a specified temp. SOLUTION: A dielectric, e.g. Al nitride constituting a holder has a surface of mirror finish surface, a wafer W is attracted to the holder with an attraction force of 1 kg/cm2 or more by an electrostatic chuck, an H gas from a gas feed line 5 is sealed at the back side of the wafer W, a flow-meter 54 is provided at the gas feed line 5 and comparator 6 compares the measured flow rate thereof with a threshold, corresponding to the flow rate at abnormal gas leaking, at the back side of the wafer W.
申请公布号 JP2000021869(A) 申请公布日期 2000.01.21
申请号 JP19980201285 申请日期 1998.06.30
申请人 TOKYO ELECTRON LTD 发明人 AMANO HIDEAKI
分类号 H01L21/302;C23C16/458;H01L21/00;H01L21/3065;H01L21/31;H01L21/683;(IPC1-7):H01L21/31;H01L21/306 主分类号 H01L21/302
代理机构 代理人
主权项
地址