| 摘要 |
PROBLEM TO BE SOLVED: To provide a multichip module which is capable of testing semiconductor chips comprised in an integrated circuit package without increasing parts in number. SOLUTION: Input terminals 12 through which test signals are inputted from outside, a switching circuit 210 which switches a normal mode to a test mode and vice versa, and output terminals 14 through which the output of a first semiconductor chip 2 is monitored outside of the chip are provided in the first semiconductor chip 2, input terminals 15 through which test signals are inputted from outside, output terminals 17 through which the input of a second semiconductor chip 3 is monitored, and a switching circuit 300 which switches a normal mode to a test mode or vice versa are provided in the second semiconductor chip 3, the first semiconductor chip 2 or the second semiconductor chip 3 is tested supplying test signals through the input terminals 11 or the input terminals 15, and a connection between the semiconductor chips 2 and 3 is tested. |
