发明名称 PLASMA TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma treating apparatus, capable of uniformly treating a work having a large area, without making the apparatus large in size. SOLUTION: The top of a reactor chamber 2 has heat-resistive and microwave-permeable properties and moreover is hermetically sealed with a sealing plate 12 of a dielectric having low dielectric loss. At the reactor chamber 2 side of the sealing plate 12, a counter electrode 11 having an opening 11a faces a stage 7, the seal plate 12 has a protrusion fitted in an opening 11a of the counter electrode 11, the lower face of the protrusion is flush with that of the counter electrode 11, and a high frequency power source 9 is connected to the stage 7 so as to ground the counter electrode 11.
申请公布号 JP2000021863(A) 申请公布日期 2000.01.21
申请号 JP19980190788 申请日期 1998.07.06
申请人 SUMITOMO METAL IND LTD 发明人 YOSHIDA TAKESHI
分类号 H05H1/46;C23C16/50;C23C16/511;C23F4/00;H01L21/302;H01L21/3065 主分类号 H05H1/46
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