| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma treating device capable of improving treating quality by further separating the deposition region of a reaction product from a board processing region in a vacuum processing chamber. SOLUTION: A reaction product deposited in a board processing region is decomposed and removed by performing the plasma cleaning of the inside of a vacuum processing chamber 43 by the use of a first plasma generation part P generating board processing plasma. Thereafter plasma cleaning of a region nearer to the exhaust side than the board processing region is carried out by the use of a second plasma generation part P2 installed at the lower part of a board susceptor 50, a reaction product depositing region is separated from the board processing region and thus, the production of particles are restrained. |
