ELECTRONIC CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a semiconductor device that has high bonding strength between a circuit substrate and an IC, and high reliability in terms of environmental resistance. SOLUTION: A pattern 3 for reinforcing bonding is arranged adjacent to the terminal for IC connection of a circuit substrate where a pattern 2 is formed on an insulating substrate 1 of a polyimide film or the like, and an the adhesion force between an IC 4 and the circuit substrate is increased, thus improving reliability against change in temperature. Also, the reliability due to moisture resistance is improved for a substrate with high moisture permeability such as polyimide.