| 摘要 |
PROBLEM TO BE SOLVED: To realize a high-accuracy solder precoat by a convenient processing work to realize a high-accuracy electronic component mounting. SOLUTION: A solder resist 22 is deposited to regions on a wiring board body 201 for mounting an electronic component body 211, except component connecting pads 203, a plurality of openings 221 are provided at the solder resist 22 on ground connecting pads 202 of the circuit board body 201, and solder 23 is precoated on the ground connecting pads 202 and component connecting pads 203, except the solder resist 22.
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