发明名称 FORMING METHOD FOR HIGH HEAT CONDUCTIVE SEALING MATERIAL
摘要 PROBLEM TO BE SOLVED: To make high heat-conductive sealing material applicable to minute parts, by injecting slurry containing a filler dispersed in a dispersion medium having a viscosity lower than that of a thermosetting resin into a region to be sealed, removing only the dispersion medium and filling in the region with the filler with a high density, impregnating the filler with a thermosetting resin, hardening it and sealing. SOLUTION: A slurry containing a filler dispersed in a dispersion medium having a viscosity lower than that of a thermosetting resin is injected from an injecting part into a region to be sealed, and the gaps of coil wires 3 wound on the core 2 of a small-sized motor coil 1 are filled with the filler. On the occasion, the slurry is injected excessively 20-30% more than the volume of the gaps, and the slurry is caused to stay even on the top. If this is left as it is, the filler is deposited by the specific gravity difference. And the gaps are filled up with a high density of a filling-up ratio of 60-65 vol.%, by removing the dispersion medium by drying it spontaneously or heating it. And the air gaps of an objective component are sealed by impregnating the filler with a thermosetting resin, and hardening it after that.
申请公布号 JP2000023432(A) 申请公布日期 2000.01.21
申请号 JP19980187559 申请日期 1998.07.02
申请人 TOYOTA MOTOR CORP 发明人 TAKAHASHI YASUSHI
分类号 H02K15/12;(IPC1-7):H02K15/12 主分类号 H02K15/12
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