| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a flip chip mounted on a board with bumps as medium and a manufacturing method thereof, wherein the flip chip can be easily repaired without being damaged. SOLUTION: A semiconductor device 11 has a structure where a resin layer 13 is provided to the surface of the flip chip mounting region of a board 2, the bump connection surface and peripheral side of the flip chip 3, and the surfaces of the bumps, a resin layer 14 is provided covering the resin layer 13 around the flip chip mounting region and the resin layer 13 on the peripheral side of the flip chip 3, the resin layer 13 is formed of resin that is soluble with a first solvent, and the resin layer 14 is formed of resin that is soluble in a second solvent but not soluble in the first solvent, and a method of manufacturing the semiconductor device 11 comprises a process where the resin layers 13 and 14 are practically formed.
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