发明名称 MANUFACTURE OF INFRARED RAY BOLOMETER OF 3-LAYER STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an infrared ray bolometer of 3-layer structure wherein each layer has an improved fill-factor. SOLUTION: A substrate 212 and a drive matrix layer 210 comprising a pair of connection terminals 214 are prepared, and a first sacrifice layer comprising a pair of cavities is formed at the upper part of the drive matrix layer 210, with a supporting layer comprising a pair of bridges wherein a conductive wire is formed at each upper part formed. A second sacrifice layer comprising a pair of through holes is formed at the upper part of the first sacrifice layer and the pair of bridges, an absorption layer comprising a bolometer element surrounded by an absorbent is formed, and the first and second sacrifice layers are removed to form an infrared ray bolometer of 3-layer structure.
申请公布号 JP2000019011(A) 申请公布日期 2000.01.21
申请号 JP19980177497 申请日期 1998.06.24
申请人 DAEWOO ELECTRONICS CO LTD 发明人 SHU SOHAKU
分类号 G01J1/02;G01J5/20;(IPC1-7):G01J1/02 主分类号 G01J1/02
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