发明名称 MEASURING APPARATUS AND MEASURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a measuring apparatus and a measuring method which can measure further microstructure of an object to be measured and structure in the depth direction. SOLUTION: A UV laser beam is generated by the wavelength conversion of a laser beam from a solid-state laser beam source. Through heterodyne detection or homodyne detection using the UV laser beam, structure of an object 2 to be measured is measured. Thereby microstructure can be measured. Alternatively, a laser beam is divided into a plurality of laser lights, and frequency shift is so performed that the laser beams have different frequencies. The respective laser beams are made to form images at different positions of focal point, and heterodyne detection is performed. Obtained heterodyne signals are subjected to frequency band isolation, so that the structures of the object to be measured corresponding to the respective imaging points are measured. Thereby the structure also in the depth direction of the object to be measured can be measured.
申请公布号 JP2000018916(A) 申请公布日期 2000.01.21
申请号 JP19980187774 申请日期 1998.07.02
申请人 SONY CORP 发明人 OKA MICHIO
分类号 G01B9/02;G01B11/00;G02B21/16;(IPC1-7):G01B11/00 主分类号 G01B9/02
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