| 摘要 |
An apparatus and method for reducing noise and/or heat on a device such as a spherical-shaped semiconductor integrated circuit (10). The integrated circuit is formed around a spherical substrate (20). Surrounding the integrated circuit is a conductive layer (14). The conductive layer (14) is only connected to at least one bonding pad of the integrated circuit. The conductive layer (14) serves to absorb energy such as heat and/or electromagnetic noise. |
