发明名称 |
ELECTROPLATING REACTOR INCLUDING BACK-SIDE ELECTRICAL CONTACT APPARATUS |
摘要 |
An apparatus for electroplating a workpiece wherein the apparatus includes a workpiece holding structure (260) having a workpiece support (120) with at least one surface being engaged to a front side of the workpiece and at least one electrical contact (154) in contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the electrical contact(s) (154) and a front-side of the workpiece to facilitate electroplating of the front-side surface. An actuator (126) is provided for driving the workpiece support (120) between a first position in which the workpiece electrical contact(s) and the workpiece holding structure contact(s) (154) are disengaged from one another, and a second position in which the workpiece electrical contact(s) (154) and the workpiece holding structure contact(s) are electrically engaged. |
申请公布号 |
WO0003071(A1) |
申请公布日期 |
2000.01.20 |
申请号 |
WO1999US15566 |
申请日期 |
1999.07.09 |
申请人 |
SEMITOOL, INC. |
发明人 |
WOODRUFF, DANIEL, J.;HANSON, KYLE, M.;BATZ, ROBERT, W.;KUECHMANN, JAMES, T. |
分类号 |
C25D7/12;H01L21/687;(IPC1-7):C25D17/04;C25B11/00;C25B9/00;C25D17/00;B05C3/02;B05C3/00;C23F1/02;C23C16/00;B05C13/00 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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