发明名称 ELECTROPLATING REACTOR INCLUDING BACK-SIDE ELECTRICAL CONTACT APPARATUS
摘要 An apparatus for electroplating a workpiece wherein the apparatus includes a workpiece holding structure (260) having a workpiece support (120) with at least one surface being engaged to a front side of the workpiece and at least one electrical contact (154) in contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the electrical contact(s) (154) and a front-side of the workpiece to facilitate electroplating of the front-side surface. An actuator (126) is provided for driving the workpiece support (120) between a first position in which the workpiece electrical contact(s) and the workpiece holding structure contact(s) (154) are disengaged from one another, and a second position in which the workpiece electrical contact(s) (154) and the workpiece holding structure contact(s) are electrically engaged.
申请公布号 WO0003071(A1) 申请公布日期 2000.01.20
申请号 WO1999US15566 申请日期 1999.07.09
申请人 SEMITOOL, INC. 发明人 WOODRUFF, DANIEL, J.;HANSON, KYLE, M.;BATZ, ROBERT, W.;KUECHMANN, JAMES, T.
分类号 C25D7/12;H01L21/687;(IPC1-7):C25D17/04;C25B11/00;C25B9/00;C25D17/00;B05C3/02;B05C3/00;C23F1/02;C23C16/00;B05C13/00 主分类号 C25D7/12
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