发明名称 BONDING METHOD AND DEVICE THEREOF
摘要 PROBLEM TO BE SOLVED: To set and correct offset highly accurately, without impairing productivity. SOLUTION: A position detecting camera 7 is moved to the upper part of a reference mark 10a. The positional relation of the reference mark 10a to an optical axis 7a of the position detecting camera 7 is measured with the position detecting camera 7. A tool 4 is moved on the reference mark 10a based on the offset amount stored beforehand, and the positional relation of the reference mark 10a to the tool 4 is measured by an offset correcting camera 12. Based on the results of these measurements, the offset amount stored beforehand is corrected, and accurate offset amount is obtained.
申请公布号 JP2000021923(A) 申请公布日期 2000.01.21
申请号 JP19980189118 申请日期 1998.07.03
申请人 SHINKAWA LTD 发明人 KYOMASU RYUICHI;KATO MOTOHIKO
分类号 H01L21/60;B23K20/00;B23Q15/22;G06T7/00 主分类号 H01L21/60
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