| 摘要 |
<p>A conduction condition detecting means which can detect a conduction condition (contact condition) of a plurality of feeding contacts in contact with the conduction portion of a substrate to be plated, and a plating device which can form a plating film with a uniform film thickness by uniformizing plating currents flowing through individual feeding contacts. A plating device which plates a substrate to be plated (12), wherein an electrode (13) and a substrate to be plated (12) mounted to a plating jig (11) are arranged opposite to each other in a plating tank (10), the plating jig (11) is provided with a plurality of feeding contact (15) to come into contact with the conduction portion provided on the surface of the substrate to be plated (12), and a specified voltage is applied between the feeding contacts (15) and the electrode (13) to supply a plating current through the feeding contacts (15), the plating device being provided with a conduction condition detecting means (22) for detecting a conduction condition between individual feeding contacts (15) of the plating jig (11) and the conduction portion of the substrate to be plated (12).</p> |
