发明名称 ELECTROPLATING REACTOR INCLUDING BACK-SIDE ELECTRICAL CONTACT APPARATUS
摘要 <p>An apparatus for electroplating a workpiece wherein the apparatus includes a workpiece holding structure (260) having a workpiece support (120) with at least one surface being engaged to a front side of the workpiece and at least one electrical contact (154) in contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the electrical contact(s) (154) and a front-side of the workpiece to facilitate electroplating of the front-side surface. An actuator (126) is provided for driving the workpiece support (120) between a first position in which the workpiece electrical contact(s) and the workpiece holding structure contact(s) (154) are disengaged from one another, and a second position in which the workpiece electrical contact(s) (154) and the workpiece holding structure contact(s) are electrically engaged.</p>
申请公布号 WO2000003071(A1) 申请公布日期 2000.01.20
申请号 US1999015566 申请日期 1999.07.09
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