发明名称 NONCONTACT IC CARD AND MANUFACTURE THEREOF
摘要 <p>A noncontact IC card comprises a card substrate (11), an IC chip (12) on the card substrate (11), and an antenna circuit (13) formed on the card substrate (11) and having a pair of antenna terminals (13a, 13b), the antenna terminal (13a) being connected with the IC chip (12). An insulating layer (14) is formed on at least part of the antenna circuit (13), and an interconnect layer (15) is formed to cross over the insulating layer (14). One end (15a) of the interconnect layer (15) is connected with the IC chip (12), while the other end (15b) is connected with the other antenna terminal (13b) of the antenna circuit (13). The card substrate (11) is covered with protective layers (16a, 16b) to protect the IC chip (12) and the antenna circuit (13).</p>
申请公布号 WO2000003354(P1) 申请公布日期 2000.01.20
申请号 JP1999003709 申请日期 1999.07.08
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