| 发明名称 |
Heat sink for surface mounted power semiconductor device |
| 摘要 |
The semiconductor heat sink device has a circuit board (2) provided with a heat conductive layer (3) in thermal contact with the power semiconductor component (4). Also mounted on the printed circuit board is an upstanding heat sink element (5), made of a heat conductive material for dissipating the waste heat generated by the power semiconductor component. |
| 申请公布号 |
DE19832450(A1) |
申请公布日期 |
2000.01.20 |
| 申请号 |
DE1998132450 |
申请日期 |
1998.07.18 |
| 申请人 |
FRANKL & KIRCHNER GMBH & CO KG FABRIK FUER ELEKTROMOTOREN U. ELEKTRISCHE APPARATE |
发明人 |
NOHL, GERD FRIEDRICH |
| 分类号 |
H01L23/36;H01L23/367;(IPC1-7):H05K7/20;H01L23/34 |
主分类号 |
H01L23/36 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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