| 摘要 |
<p>An apparatus and method for coating fluid on a semiconductor device such as those that are spherical in shape. Provided is a process tube (120) containing a plurality of apertures (18a, 18b) and including a fluid portion for receiving the fluid so that the fluid may form a bubble completely filling the fluid portion. The process tube receives the semiconductor devices and directs them into and through the bubble. The tube is surrounded by a reservoir (24) of the fluid. The reservoir is used to provide the fluid to the fluid portion of the tube through apertures in the tube. The process tube receives the semiconductor devices and directs them into and through the fluid portion, and hence the bubble. As a result, fluid completely covers the device without the device ever being in physical contact with the processor.</p> |
