Biometrical sensor for fingerprint identification for mobile phone

摘要

The sensor chip (2) has connection contacts in the form of electrical conductive bumps (9). The bumps contact connective conductors (5) of the chip housing (1) which are arranged in or on the chip housing. An adhesive layer (10) is located between the scratch proof covering (12) of the upper side of the chip and the chip housing , around the sensor field (8). The thickness of the layer is matched to the height of the bumps so that a rigid connection is created between the sensor chip and the chip housing. In addition to the bumps, a further support bump on the upper side of the sensor chip, is located to prevent tipping of the chip relative to the housing.