Electronic circuit including capacitative sensing probe and improved methods of testing

摘要

The die element (8) has active-circuit elements and a capacitative testing probe (18) carried by the die is conductively linked to a terminal connection point. The probe is insulated from the active circuit elements and their associated metallisation, and can itself be formed as part of the semiconductor or as a metallisation or deposit of conductive material. Greater sensitivity and improved 'line of sight' for capacitative testing is obtained.