发明名称 FORMATION OF ELECTRODEPOSITED POLYIMIDE COMPOSITE FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for forming the electrodeposited polyimide composite film which has improved water-repellent properties, e.g. hightened durability of ink repellent function or has excellent wear resistance and mold releasability. SOLUTION: An electroconductive film 2 is first formed on one side or both sides of the surfaces of the resin substrate 1 and then an electrodeposited polyimide composite film 5 is formed on the electroconductive film 2 while keeping the state that one or two or more codepositing particles selected from water repellent fine particles, wear resistant fine particles and mold releasable fine particles are codeposited on the film 2. This process can be applied for producing a nozzle plate having a discharge nozzle by using the water repellent particles as the codepositing particles. The electrodeposited polyimide composite film can also be directly formed on one side or both sides of the surfaces of a metal substrate.
申请公布号 JP2000017490(A) 申请公布日期 2000.01.18
申请号 JP19980182235 申请日期 1998.06.29
申请人 SONY CORP 发明人 YAMANAKA HIDEO
分类号 B41J2/135;C09D5/44;C09D179/08;C25D13/06;C25D15/00;(IPC1-7):C25D15/00 主分类号 B41J2/135
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