发明名称 PLATING SYSTEM
摘要 PROBLEM TO BE SOLVED: To make it possible to continuously execute an in-vacuum treatment and plating treatment. SOLUTION: A wet process plating apparatus 30 is connected via a second vacuum chamber 80 to a first vacuum chamber 40 contg. a transfer mechanism 70. This second vacuum chamber 80 is provided with heating means 82, 84, 85. Heating and drying are executed in addition to vacuum drying. A series of deposition treatments from the respective vacuum apparatus 52, 53 to the wet process plating apparatus 30 are continuously, rapidly and exactly carried out in a sheet-fed treatment manner.
申请公布号 JP2000017498(A) 申请公布日期 2000.01.18
申请号 JP19980180552 申请日期 1998.06.26
申请人 FOI:KK 发明人 OKUMURA YUTAKA
分类号 C25D7/12;C25D19/00;H01L21/203;H01L21/288;(IPC1-7):C25D19/00 主分类号 C25D7/12
代理机构 代理人
主权项
地址