| 摘要 |
A reactive hot melt adhesive contains, as resin component, a reaction product of a) 30 to 50 wt-% of an epoxy resin, solid at root temperature, prepared from bisphenol A and/or bisphenol F and epichlorhydrin with an epoxide equivalent weight of 400 to 700, b) 10 to 25 wt-% of an epoxy resin, liquid at room temperature, prepared from bisphenol A and/or bisphenol F and epichlorhydrin with an epoxide equivalent weight of 150 to 220 and c) 35 to 50 wt-% amino-terminated polyethylene and/or polypropylene glycols.
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