发明名称 GAS DEPOSITION METHOD AND ITS APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a gas deposition method which is capable of stably evaporating a metallic material of a high m. p. and active metallic material and is capable of stably forming superfine particle films having high purity and uniformity for a long time and an apparatus therefor. SOLUTION: A gaseous He circulating circuit is formed by a superfine particle forming chamber 21, transporting pipe 31 and film forming chamber 41 positioned on a perpendicular line and a gas purifying and circulating device 51. An arc discharge is induced between a water cooled copper hearth 15 as an anode loaded with a hemispherical Ti-Ni alloy 17 and a tungsten chip 19 as a cathode held on a negative electrode holder 18 right thereabove to locally heat and evaporate the front end of the Ti-Ni alloy 17 in the superfine particle forming chamber 21. The formed superfine particles are ejected from a nozzle 32 through the transporting pipe 32 to form the superfine particle film on the substrate 42 in the film forming chamber 41.
申请公布号 JP2000017427(A) 申请公布日期 2000.01.18
申请号 JP19980205893 申请日期 1998.07.06
申请人 VACUUM METALLURGICAL CO LTD 发明人 IWASHIGE HIROSHI
分类号 C23C14/26;C23C24/04;(IPC1-7):C23C14/26 主分类号 C23C14/26
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