发明名称 |
GAS DEPOSITION METHOD AND ITS APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a gas deposition method which is capable of stably evaporating a metallic material of a high m. p. and active metallic material and is capable of stably forming superfine particle films having high purity and uniformity for a long time and an apparatus therefor. SOLUTION: A gaseous He circulating circuit is formed by a superfine particle forming chamber 21, transporting pipe 31 and film forming chamber 41 positioned on a perpendicular line and a gas purifying and circulating device 51. An arc discharge is induced between a water cooled copper hearth 15 as an anode loaded with a hemispherical Ti-Ni alloy 17 and a tungsten chip 19 as a cathode held on a negative electrode holder 18 right thereabove to locally heat and evaporate the front end of the Ti-Ni alloy 17 in the superfine particle forming chamber 21. The formed superfine particles are ejected from a nozzle 32 through the transporting pipe 32 to form the superfine particle film on the substrate 42 in the film forming chamber 41.
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申请公布号 |
JP2000017427(A) |
申请公布日期 |
2000.01.18 |
申请号 |
JP19980205893 |
申请日期 |
1998.07.06 |
申请人 |
VACUUM METALLURGICAL CO LTD |
发明人 |
IWASHIGE HIROSHI |
分类号 |
C23C14/26;C23C24/04;(IPC1-7):C23C14/26 |
主分类号 |
C23C14/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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