| 摘要 |
PROBLEM TO BE SOLVED: To prepare an epoxy resin composition for sealing semiconductors, excellent in moldability, reliability at high temperatures and capable of giving high incombustibility by including an epoxy resin, a phenolic resin and a hardening accelerator respectively having specific structures. SOLUTION: This epoxy resin composition for sealing semiconductors contains (A) an epoxy resin of formula I [R1 is H, a 1-4C alkyl, or the like; (n) is 0-10], (B) phenolic resin hardener of formula II [R2 is H, a 1-4C alkyl, or the like; (m) is 0-10], (C) inorganic filler and (D) a hardening accelerator of formula III [R3 is a 1-4C alkyl, an alkoxy, or the like; (r) is an integer of 1-3; (a) is an integer of 0-2] and/or formula IV [R4 and R5 are each a 1-4C alkyl or the like; (s) and (t) are each an integer of 1-3; (b) and (c) are each an integer of 0-3] as essential ingredients. The content of the ingredients D is 0.1-5 pts.wt. based on 100 pts.wt. of the total of ingredients A and B. The composition can give semiconductor devices having high reliability.
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