| 摘要 |
PROBLEM TO BE SOLVED: To provide the curable composition for the back fixing material used in the fabrication of the shadow mask, which gives a cured film excellent in all of etching resistance, alkali-solubility-releasability and pattern formability when a second etching is carried out at high temp. SOLUTION: The curable composition for back fixing material, which is used in a second etching process for the fabrication of the shadow mask, comprises (a) a compound having one carboxyl group and one (meth)acryloyl group, (b) a tri(meth)acrylate of an alkylene oxide addition product of isocyanuric acid and (c) two or more (meth)acryloyl groups. The cured material of the curable composition has alkali-solubility or alkali-releasability. |
