| 摘要 |
PROBLEM TO BE SOLVED: To obtain a film excellent in resistance to heat and reliability in moisture resistance by forming it from a specific heat-bonding polyimide resin. SOLUTION: The objective film is formed from a heat-bonding polyimide resin represented by formula I, preferably the one having a glass transition temperature of not higher than 300 deg.C, desirably 100-200 deg.C. In formula I, R1 is a group of formulae II-IX; R2 is C3H6, C4H8 or a group of formula X; (n) is 1-20; and (a) and (b) are numbers satisfying the equation: 0.2<=a/(a+b)<=0.99. The resin of formula I can be a random copolymer or a block copolymer. This resin can be prepared, for example, by reacting 3,3',4,4',- benzophenonetetracarboxylic acid dianhydride with a silicon-containing diamine or silicon-free diamine e.g. 2,2-bis[4-(4-aminophenoxy)phenyl[propane} to obtain a silicon-modified polyamide acid represented by formula X1 or a silicon- unmodified polyamide acid, followed by imidation by heat or the like. |
