发明名称 |
MOLD FOR INJECTION MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To obtain a molded article with few burrs by ensuring strength of a mold and holding flatness of a cavity face in a mold for injection molding for a thermosetting resin. SOLUTION: By enlarging size of a plate 7 for a manifold to the same size as that of a cavity mold plate 8 and discontinuing a spacer block and an air insulation layer which are provided on the outer periphery of the manifold in the conventional apparatus and arranging a heat insulation plate 11 on the whole face receiving molding pressure, strength of a mold is improved and difference in thermal expansion caused by difference in structure in the mold is eliminated to hold flatness of the cavity face and to obtain a molded article with few flash.
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申请公布号 |
JP2000015665(A) |
申请公布日期 |
2000.01.18 |
申请号 |
JP19980190665 |
申请日期 |
1998.07.06 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MORIMOTO TAKASHI;KATAYAMA AKINOBU;OKUBO NAOYUKI |
分类号 |
B29C45/26;B29C45/27;(IPC1-7):B29C45/26 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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