发明名称 MOLD FOR INJECTION MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain a molded article with few burrs by ensuring strength of a mold and holding flatness of a cavity face in a mold for injection molding for a thermosetting resin. SOLUTION: By enlarging size of a plate 7 for a manifold to the same size as that of a cavity mold plate 8 and discontinuing a spacer block and an air insulation layer which are provided on the outer periphery of the manifold in the conventional apparatus and arranging a heat insulation plate 11 on the whole face receiving molding pressure, strength of a mold is improved and difference in thermal expansion caused by difference in structure in the mold is eliminated to hold flatness of the cavity face and to obtain a molded article with few flash.
申请公布号 JP2000015665(A) 申请公布日期 2000.01.18
申请号 JP19980190665 申请日期 1998.07.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORIMOTO TAKASHI;KATAYAMA AKINOBU;OKUBO NAOYUKI
分类号 B29C45/26;B29C45/27;(IPC1-7):B29C45/26 主分类号 B29C45/26
代理机构 代理人
主权项
地址