发明名称 METHOD FOR COATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To cost effectively and efficiently form films of a uniform thickness and high purity at ordinary temp. on nonconductor substrates of intricate shapes with simple equipment by installing these substrates into the space between electrodes and loading powder of a coating material therein, then impressing AC voltage between the electrodes to vibrate the powder. SOLUTION: The hermetic space 130 is formed between the cylindrical electrode 101 and the columnar electrodes 102 arranged at its center via insulative disks 103, 104 and the nonconductor substrates 120, 121 in the font of outside cylindrical pipes are installed therein. A prescribed amt. of the powder 105 of the coating material is loaded into the space 130. The powder 105 is preferably a metal or metal compd. of 0.05 to 300μm in average grain size. The pressure in the hermetic space 130 is reduced to <=10-2 Torr and the AC voltage of peak voltage 2 to 80 kV and frequency 50 Hz to 60 MHz is impressed between both electrodes. The power 105 vibrates in the electric field by receiving kinetic energy of >=1×105 eV and alternately collides against the nonconductor substrates 120, 121 and accumulates thereon, thereby forming the films having a high adhesivity and coating the substrates.
申请公布号 JP2000017455(A) 申请公布日期 2000.01.18
申请号 JP19980186256 申请日期 1998.07.01
申请人 SUGAI ISAO;KUSHIBIKI ATSUO;SUGAI TOMOKO 发明人 SUGAI ISAO;KUSHIBIKI ATSUO
分类号 C01G1/00;B05D1/00;C01G3/00;C23C24/00;C23C24/04;(IPC1-7):C23C24/04 主分类号 C01G1/00
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