发明名称 |
RESIN COMPOSITION FOR PLATING AND PLATED MOLDINGS |
摘要 |
PROBLEM TO BE SOLVED: To provide an improved AES resin composition for plating that can be readily plated under similar conditions to those in plating conventional ABS resins and plated moldings. SOLUTION: This resin composition comprises (A) 10-80 pts.wt. of a graft polymer prepared by grafting an aromatic vinyl and vinyl cyanide onto an ethylene-propylene rubber, (B) 10-60 pts.wt. of a graft polymer prepared by grafting a (meth)acrylic ester or a mixture thereof with other copolymerizable monomers onto a conjugated diene rubber having a weight-average particle size of 0.1-0.4μm, (C) 10-80 pts.wt. of a copolymer of an aromatic vinyl and vinyl cyanide and (D) 0.01-5.0 pts.wt. of a polyorgnao-siloxane per 100 pts.wt. of (A)+(B)+(C).
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申请公布号 |
JP2000017138(A) |
申请公布日期 |
2000.01.18 |
申请号 |
JP19980201159 |
申请日期 |
1998.06.30 |
申请人 |
SUMIKA ABS LATEX KK |
发明人 |
ITO MASANORI;EGAWA HIDETOSHI;AOKI HIROMITSU |
分类号 |
C08L25/04;C08L51/04;C08L83/04;(IPC1-7):C08L51/04 |
主分类号 |
C08L25/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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