发明名称 RESIN COMPOSITION FOR PLATING AND PLATED MOLDINGS
摘要 PROBLEM TO BE SOLVED: To provide an improved AES resin composition for plating that can be readily plated under similar conditions to those in plating conventional ABS resins and plated moldings. SOLUTION: This resin composition comprises (A) 10-80 pts.wt. of a graft polymer prepared by grafting an aromatic vinyl and vinyl cyanide onto an ethylene-propylene rubber, (B) 10-60 pts.wt. of a graft polymer prepared by grafting a (meth)acrylic ester or a mixture thereof with other copolymerizable monomers onto a conjugated diene rubber having a weight-average particle size of 0.1-0.4μm, (C) 10-80 pts.wt. of a copolymer of an aromatic vinyl and vinyl cyanide and (D) 0.01-5.0 pts.wt. of a polyorgnao-siloxane per 100 pts.wt. of (A)+(B)+(C).
申请公布号 JP2000017138(A) 申请公布日期 2000.01.18
申请号 JP19980201159 申请日期 1998.06.30
申请人 SUMIKA ABS LATEX KK 发明人 ITO MASANORI;EGAWA HIDETOSHI;AOKI HIROMITSU
分类号 C08L25/04;C08L51/04;C08L83/04;(IPC1-7):C08L51/04 主分类号 C08L25/04
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