| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered plastic sheet having no point at issue such that flip chips collide with the inner wall of an embossed carrier tape by the vibration during transport as the sheet for taping the embossed carrier tape of the chips to be cracked or broken. SOLUTION: In a multilayered plastic sheet consisting of a plastic layer (A-layer) with bending modulus of 8,000-35,000 kgf/cm2 and a plastic layer (B- layer) with bending modulus of 100-5,000 kgf/cm2, the thickness ratio of the B-layer is 1-20% of the total thickness of the sheet and a coating layer of conductive coating is provided to the sheet at least on the side of the B-layer and the surface specific resistance value on the side of the coating layer is 1×104-1×108Ω.
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