| 摘要 |
PROBLEM TO BE SOLVED: To provide a both surface polishing device for a semiconductor wafer, which hardly impair the polishing clothes attached to an upper and a lower level block by the gear edge portion of an outer gear during polishing. SOLUTION: When both the face-to-face surfaces of a silicon wafer W are polished, polishing is put in operation by letting each carrying plate 15 be rotated, and revolved in a space between an upper and a lower level block 11 and 12 while abrasion liquid is being fed thereto. In this case, since polishing clothes 16 and 17 stretched over the upper and lower level blocks 11 and 12 are formed out of elastic bodies comparatively thick in thickness, the edge portion of each outer gear 15b of each carrier plate 15 is movingly brought into contact with the surfaces of the polishing clothes 16 and 11. However, the edge portion of each gear 15c is chamfered in advance so as to be rounded, the polishing surfaces of the polishing clothes 16 and 17 are hardly impaired. |
