发明名称 COATING FILM STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a Pd-compound coating containing a nitrogen-containing organic compound having the ability to accelerate plating, which is coated on an insulating substrate and is capable of being electrolytically plated without deposition of an active metal or chemical plating. SOLUTION: The coating has the structure that a coated film having a thickness of 20-2,000 nm is formed on a support material and Pd, N, C and O elements are contained in the film, wherein the Pd has a peak of binding energy in the range of 336-338 eV in analysis by X-ray photoelectron spectroscopy(XPS or ESCA). Preferably, Pd-content in the interface between the support material and the coating and in the surface of coating is high.
申请公布号 JP2000017484(A) 申请公布日期 2000.01.18
申请号 JP19980202865 申请日期 1998.07.03
申请人 ASAHI CHEM IND CO LTD 发明人 YAMADA HIROSHI;YOSHIDA KOZO
分类号 C25D5/34;C25D5/54;H05K3/18;(IPC1-7):C25D5/54 主分类号 C25D5/34
代理机构 代理人
主权项
地址