| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyamideimide resin which can be synthesized in a non- nitrogenous polar solvent, has a heat resistance and a low elastic modulus, is excellent in a low degree of warpage, flexibility, curability in a low temperature, electric properties, adhesiveness, moisture resistance, bendability, operability and cost and also to provide a preparation process of the resin, and to obtain a polyamideimide resin composition and a polyamideimide resin paste. SOLUTION: In this case preparation process of a polyamideimide resin, the resin is obtained by reacting a mixture of (a) a carboxylic acid containing a diimidedicarboxylic acid of the formula (wherein (n) is an integer of 1-100; R1 is a bivalent aliphatic group; and R2 is a monovalent aliphatic or aromatic group) obtained by a reaction between a diaminopolysiloxane and a trivalent carboxylic acid having an acid anhydride group or its derivative with (b) an aromatic polyisocyanate is a non-nitrogenous polar solvent. A composition contains this resin and an epoxy resin. A thixotropic resin paste is obtained by dispersing fine particles in the resin or the composition.
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