A surface mount socket having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.
申请公布号
US6015301(A)
申请公布日期
2000.01.18
申请号
US19980121452
申请日期
1998.07.23
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BRODSKY, WILLIAM LOUIS;CHAN, BENSON;MYRTO, GLENN EDWARD;SHERMAN, JOHN HENRY