| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot melt adhesive composition which is capable of coat ing at a low temperature and a heating temperature to adhere is low due to thermoactivity, being excellent in an adhering performance, especially in creep- resistance, besides having an appropriate softness and without irritant smell. SOLUTION: A hot melt adhesive composition is obtained from mixing with heating and stirring an adhesive resin and a base polymer composed of a copolymer of ethylene and 3-18Cα-olefin, a melt flow rate(MFR) is 0.1-1,000 g/10 min, the temperature of maximum peak in elution curve by temperature-rising- elution-fractionation(TREF) is 15-85 deg.C, a value of H/W is not less than 2 wherein H is a peak height and W is a peak width at one-thirds of the peak height, and the Vicat softening temperature is 15-85 deg.C.
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