| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. to give a semiconductor device being free from the occurrence of voids and having excellent curability, adhesiveness to a passivation membrane and moisture resistance on moisture absorption. SOLUTION: This compsn. contains as the essential components (A) an epoxy resin having two or more epoxy groups in the mol., (B) a phenol resin having two or more phenolic groups in the mol., and (C) a curing accelerator expressed by the formula (wherein R1 and R2 are each hydrogen, a 1-6C alkyl group, or a 1-6C alkoxyl group, and may be or different same except a case when the both are hydrogen, R3 is hydrogen or a 1-6C alkyl group; and (m) is 1 or 2).
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