发明名称 |
Solder resist ink composition of a novolak-epoxy resin |
摘要 |
The photo-curable liquid solder resist ink composition of the present invention mainly comprises a photo-polymerizable resin having sufficient molecular weight and (meth)acryloyl groups which are imparted by both of introduction of (meth)acryloyl groups into a novolak-type epoxy resin having 4 or more of benzene nuclei and polymerization using a chain-extension agent. The composition is useful for a photo-curable type resist, since it can produce a coated film excellent in tack free characteristic and resolution, and can produce a cured film excellent in heat resistance, adhesiveness, and chemical resistance. In addition, by reacting with an acid anhydride, development with alkalis becomes possible.
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申请公布号 |
US6015651(A) |
申请公布日期 |
2000.01.18 |
申请号 |
US19970846167 |
申请日期 |
1997.04.28 |
申请人 |
NIPPON SHOKUBAI CO., LTD. |
发明人 |
AWAJI, TOSHIO;OTSUKI, NOBUAKI;ARAKAWA, MOTOHIRO;TANAKA, HIROMICHI |
分类号 |
C08F290/14;C08G59/02;C08G59/17;G03F7/027;G03F7/032;G03F7/035;G03F7/038;H05K3/28;(IPC1-7):G03C5/16;G03C1/74;C08F2/50 |
主分类号 |
C08F290/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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