发明名称 COPPER-CLAD LAMINATE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To improve the heat dissipation properties, workability, humidity resistance and heat resistance as outstanding qualities through upgrading the heat conductivity of an insulating layer by composing the insulating layer of a base having the specified content of aluminum nitride and an epoxy resin. SOLUTION: The copper-clad laminate 1 is formed of an insulating layer 2 consisting of a base made of aluminum nitride and an epoxy resin and copper foilds 3a, 3b arranged on both faces of the insulating layer 2. In this case, the fiber of the aluminum nitride shows heat dissipation effects on account of its content equivalent to 30-80% of the base. The method for manufacturing the copper-clad laminate is to first laminate plural layers of prepreg containing the epoxy resin on the base into which the aluminum nitride is intermingled and lap the copper foilds 3a, 3b on at least one of the faces of the laminated prepregs into a single molded piece. Thus the insulating layer 2 with a remarkably enhanced heat conductivity can be constituted. Consequently it is possible to manufacture the copper-clad laminate with outstanding heat dissipation properties, workability, humidity resistance and heat resistance.
申请公布号 JP2000015746(A) 申请公布日期 2000.01.18
申请号 JP19980187665 申请日期 1998.07.02
申请人 TOSHIBA CHEM CORP 发明人 HONDA NOBUYUKI
分类号 B32B15/08;B32B17/04;H05K1/03;(IPC1-7):B32B15/08 主分类号 B32B15/08
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