发明名称 |
Substrate for printed circuit board |
摘要 |
To address the problem of difficulty of making compatible flame retarding property and electrical and mechanical characteristics in conventional printed interconnection substrates, the present invention employs, in a substrate for printed circuit board of which the insulating material comprises a thermosetting resin composition comprising an epoxy resin main component and a curing agent, an epoxy resin containing a brominated phenol novolac type epoxy resin having a biphenyl skeleton as the main component or a curing agent containing a brominated phenol novolac type curing resin. It provides a substrate for printed circuit board which has an extremely high flame retarding property and a superior heat resistance and humidity resistance, as well as a high insulating reliability and a superior high frequency characteristic.
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申请公布号 |
US6015872(A) |
申请公布日期 |
2000.01.18 |
申请号 |
US19980081815 |
申请日期 |
1998.05.20 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
KAWAKITA, YOSHIHIRO;HASEGAWA, MASANARU;SAKAMOTO, KAZUNORI;HATANAKA, HIDEO |
分类号 |
B32B27/04;C08G59/18;C08L63/02;H05K1/03;(IPC1-7):B32B7/12 |
主分类号 |
B32B27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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