发明名称 Process for producing electronic parts
摘要 An electronic part, which has a complicated internal configuration and has a movable part rotatably and movably accommodated therein, is integrally molded without dividing the configuration into a plurality of sections to carry out a number of molding operations for separate sections of the electronic part, thereby reducing the cost and enhancing the quality of the electronic part. The manufacturing process comprises producing a core for the injection molding by the injection molding of a polyvinyl alcohol-based resin containing an oxyalkylene group, producing a second stage product, which has the core inserted therein so as to be partly exposed, by the injection molding of a metallization-grade aromatic polyester liquid crystalline polymer, which contains a catalyst, producing a third stage product so that the second stage product is partly exposed by the injection molding of a nonmetallization-grade aromatic polyester liquid crystalline polymer, immersing the third stage product in hot water so that the core is dissolved in hot water, etching the surface of the circuit pattern forming area, which is exposed on the surface and is made from the metallization-grade polymer, and then metallizing the etched surface so that an electrically conductive circuit is formed thereon. In the above-described process, the movable part is embedded in the core.
申请公布号 US6015523(A) 申请公布日期 2000.01.18
申请号 US19970993020 申请日期 1997.12.18
申请人 SANKYO KASEI KABUSHIKI KAISHA 发明人 YUMOTO, TETSUO
分类号 B29C45/16;B29C45/44;H05K3/00;H05K3/18;(IPC1-7):B29C33/52;B29C59/00 主分类号 B29C45/16
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