| 发明名称 |
Chemical mechanical polishing slurry and method for using same |
| 摘要 |
An aqueous chemical mechanical polishing slurry useful for polishing the polysilicon layer of a semiconductor wafer comprising an aqueous solution of at least one abrasive, and at least one alcoholamine. The slurry preferably has a pH of from about 9.0 to about 10.5 and it includes an optional buffering agent. |
| 申请公布号 |
AU5313099(A) |
申请公布日期 |
2000.01.17 |
| 申请号 |
AU19990053130 |
申请日期 |
1999.06.25 |
| 申请人 |
CABOT CORPORATION |
发明人 |
J. SCOTT STECKENRIDER;BRIAN L MUELLER |
| 分类号 |
B24B37/00;C09C1/68;C09G1/02;C09K3/14;H01L21/304;H01L21/321 |
主分类号 |
B24B37/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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