| 摘要 |
A method of material deposition of a desired material onto a substrate comprises the steps of: (i) depositing a surface-covering layer onto the substrate; (ii) depositing the desired material onto the surface-covering layer; and (iii) heating the substrate to a surface-covering removal temperature to remove at least some of the surface-covering layer. Steps (ii) and (iii) may be carried out together, so that the deposition of step (ii) may be carried out at least in part at the surface-covering-removal temperature. |
