发明名称 MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
摘要 The properties of a diffusion barrier material layer (48) over a semiconductor substrate (10) are enhanced in a simple and time-effective manner by immersing the substrate (10) in an oxidizing liquid. For a titanium-tungsten barrier metal (48), a dip in nitric acid for 1-60 minutes provides the metal with an oxide layer (50) of the right thickness of 10-20 ANGSTROM . <IMAGE>
申请公布号 KR100238564(B1) 申请公布日期 2000.01.15
申请号 KR19920007072 申请日期 1992.04.25
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 SHELDON C.P.LIM;STANLEY C.CHU
分类号 H01L21/28;H01L21/283;H01L21/3205;H01L21/60;H01L21/768;H01L23/52;(IPC1-7):H01L29/76 主分类号 H01L21/28
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